贝格斯 Liqui-Form 2000
Liqui-Form2000可供规格:
规格(Specifications): 30CC 600CC 5gallon
导热系数(Thermal Conductivity): 2.0W/m-k
颜色(Color): 灰色
包装(Pack): 美国原装进口包装
持续使用温度(Continous Use Temp): -60°~200°
密度(Density): 2.8
Liqui-Form2000应用材料特性:
热导率:2.0W/mk,适用于非常低的力组件,在组装低体积膨胀,优秀的化学和机械稳定性,即使在更高的温度,不需要养护,在存储和粘度稳定
产品为单分组,使用方便,无需混合。Liqui-Form2000是一个高的热导电性液体有力的材料设计,要求应用程序需要一个平衡可分配之间,低组件强调在装配和易于返工。
Liqui-Form2000材料应用:
汽车电子,独立元器件到外壳,PCBA到外壳,光纤通讯设备,印刷电路板组件和外壳之间,光纤通讯,设备填充各种发热设备散热片和外壳之间的差距,设备装配要求低的压力,BGA, PGA, PPGA,裸模加热机盖子
Liqui-Form2000技术优势分析:
Liqui-Form®2000是一个高度整合剪切稀化材料不需要养护、混合或制冷。其独特的制定保证优秀的热性能、低外加应力和可靠
长期性能。Liqui-Form®2000触变,自然策略确保它周围形成和保持的组件。
在应用程序中。
性能:
配置可用
Property
|
Imperial Value
|
Metric Value
|
Test Method
|
Color
|
Gray
|
Gray
|
Visual
|
Low Shear Viscosity (Pa*sec)@0.01 sec-1 (1)
|
20,000
|
20,000
|
ASTM D4473
|
High Shear Viscosity (Pa*sec)@300 sec-1 (2)
|
110
|
110
|
ASTM D2196
|
Volumetric Expansion (25 to 275oC), ppm/K
|
600
|
600
|
ASTM E228 modified
|
Outgassing, % Total Mass Loss
|
0.53
|
0.53
|
ASTM E595
|
Density (g/cc)
|
2.8
|
2.8
|
ASTM D792
|
Continuous Use Temp (oF) / (oC)
|
-76 to 392
|
-60 to 200
|
***
|
Shelf Life at 25oC (Months)
|
6
|
6
|
***
|
Electrical
|
Dielectric Strength (V/mil)/(V/mm)
|
250
|
10,000
|
ASTM D149
|
Dielectric Constant (1000 Hz)
|
8.0
|
8.0
|
ASTM D150
|
Volume Resistivity (Ohm-meter)
|
109
|
109
|
ASTM D257
|
Flame Rating
|
V-O
|
V-O
|
U.L.94
|
Thermal
|
Thermal Conductivity (W/m-K)
|
2.0
|
2.0
|
ASTM D5470
|
Thermal Performance vs Pressure
|
Pressure (psi)
|
10
|
25
|
50
|
Thermal Impedance (°C-in2/W) (3)
|
0.13
|
0.12
|
0.12
|
(1) Parallel Plate Rheometer, See Product Management Liqui-Form Application Note.
(2) Capillary Rheometer, See Product Management for Viscosity and Dispensing Application Note
(3) The ASTM D5470 test fixture was utilized.The recorded values include the interfacial thermal resistance.The values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
|